40 lines
808 B
JSON
40 lines
808 B
JSON
{
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"Nodes": [
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{
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"Key": "WaferLoad",
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"DisplayName": "晶圆上料",
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"ActivityKeywords": [
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"ChipLoad",
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"ChipLoadExecute"
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],
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"WorkflowKeywords": [],
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"ParentKeywords": []
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},
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{
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"Key": "WaferSupply",
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"DisplayName": "供片准备",
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"ActivityKeywords": [],
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"WorkflowKeywords": [
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"WaferAngleAdjustmentFlow",
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"DiePositionFlow",
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"DieTransferFlow",
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"DieRecheckFlow"
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],
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"ParentKeywords": [
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"DieAlign",
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"DieBond",
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"Inspect"
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]
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},
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{
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"Key": "WaferUnload",
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"DisplayName": "晶圆下料",
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"ActivityKeywords": [
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"ChipUnload",
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"ChipUnloadExecute"
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],
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"WorkflowKeywords": [],
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"ParentKeywords": []
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}
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]
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} |