{
  "Nodes": [
    {
      "Key": "WaferLoad",
      "DisplayName": "晶圆上料",
      "ActivityKeywords": [
        "ChipLoad",
        "ChipLoadExecute"
      ],
      "WorkflowKeywords": [],
      "ParentKeywords": []
    },
    {
      "Key": "WaferSupply",
      "DisplayName": "供片准备",
      "ActivityKeywords": [],
      "WorkflowKeywords": [
        "WaferAngleAdjustmentFlow",
        "DiePositionFlow",
        "DieTransferFlow",
        "DieRecheckFlow"
      ],
      "ParentKeywords": [
        "DieAlign",
        "DieBond",
        "Inspect"
      ]
    },
    {
      "Key": "WaferUnload",
      "DisplayName": "晶圆下料",
      "ActivityKeywords": [
        "ChipUnload",
        "ChipUnloadExecute"
      ],
      "WorkflowKeywords": [],
      "ParentKeywords": []
    }
  ]
}