主页 配方 参数设置 维护 监控 系统设置 CURRENT: DEVICE STATUS [{0}] AUTO RUN MANUAL DEBUG MAINTENANCE RECIPE EDIT SETTINGS CALIBRATION PENDING The common vision algorithm type is not supported. The common vision algorithm execution failed. The chip map sort input is invalid. 料盒设置 位置设置 气体流量设置 自动对焦 异常处理 功率检测设置 联网通信模块 流程设置模块 Process Parameter Settings Speed Parameters Global Run Parameters Substrate Load Substrate Unload Substrate Position Substrate Height Measure Wafer Load Wafer Unload Wafer Straighten Die Fly Shot Bonding Recheck Process Control Position Thresholds Straighten Thresholds Recognition Strategy Bonding Path Strategy Bonding Process Parameters Adaptive Fast Bonding Enable Substrate Load Enable Substrate Unload Enable Substrate Position Enable Height Measure Flow Enable Height Measure Enable Wafer Load Enable Wafer Unload Enable Wafer Straighten Enable Die Fly Shot Enable Bonding Enable Recheck X Direction Wafer Scan Mode: Z Scan Pose Optimization Substrate Path Mode: Region Row Mode: Wafer Row Mode: Bond By Region: Region Mode Substrate S Path Substrate X Reverse Substrate Y Reverse Wafer S Path Wafer X Reverse Wafer Y Reverse Bond By Y Direction Fast Rate Per Row: Substrate Count: Virtual Point Count: Use All Dies: Air Cool Entire Process: Enabled Adaptive Frequency Small Region Fast Bonding Small Region Low Frequency Small Region Column Threshold: Small Region Frequency: Substrate Row: Substrate Column: Substrate Map Enable Click Selection Height Measure Summary Current Substrate Recipe: Measure Mode: Configured Point Count: Measured Point Count: Height Measure Results Point Name Row Column Position X Position Y Height Value Standard Teach Position Row/Column + Offset Compensation Recheck Summary Recheck Region Recheck Region Settings Current Recheck Point Count: Visible Recheck Point Count: Current Recheck Points Function Group 1. Set Global Threshold Parameters (MM) X Axis Threshold Setting Y Axis Threshold Setting 2. Select Filter Rule Show Missing Bond Only Show X And Y Threshold Exceeded Only Show X Axis Exceeding Current Threshold Only Show Y Axis Exceeding Current Threshold Only Move To Selected Recheck Point Reset Filters Index Substrate Row Substrate Column Die Row Die Column Substrate X Substrate Y Die X Die Y X Error Y Error Status Path Type Please select a recheck point first. The current camera-axis device is not ready, so the selected recheck point cannot be reached. OK Missing Bond X Exceeded ({0:F4}) Y Exceeded ({0:F4}) Die Position Statistics Total Die Count: Pass Rate: OK Die Count: NG Die Count: Avg. X Spacing: Avg. Y Spacing: Die Map Laser Compensation Parameters Start Position Step Distance Step Count Jump Position Cycle Count Delay (s) Execution Control Trajectory Order: Standby Position -> Forward Measurement Point -> Overshoot Position -> Reverse Measurement Point -> Standby Position Execution Status Current Cycle Current Point Current Target During execution, the program performs absolute motion in the sequence: standby position -> forward measurement point -> overshoot position -> reverse measurement point -> standby position, and applies an asynchronous dwell after each point is reached. While running, only the stop button remains available so the process can be interrupted quickly. Transfer Settings Transfer Path Substrate Region Die Region Generation Settings Generation Mode: Substrate Row Direction: Wafer Row Direction: Auto Calculate Die: No. Substrate Row Substrate Column Wafer Row Wafer Column Type Move To Die Move To Pad Align Die To Pad Generate Transfer Path Level 1 Frequency: Level 2 Frequency: Level 1 Threshold: Level 2 Threshold: Global Run Features Run Mode Settings Needle Check: Needle Check Count: Weight Check: MES: Production Test Machine Aging 电梯 上料 规整 切割 平台控制 激光器控制 光源控制 功率计控制 自动对焦 DFT记录 下料 尺寸更换 IO状态 轴状态 流程状态 耗材 MTBA 产品标定 DFT参数 轴参数设置 Axis Soft Limit Settings Configuration File Controller Name Card No. Axis No. Negative Soft Limit Positive Soft Limit Apply All Apply 激光干涉仪 PLC控制 测距仪测试 MONITOR / LIVE VIEW Save Config Reset All Write All To Controller Module Independent Avoidance Avoidance (SAFE) Add avoidance axis Axis name Teach avoidance position Remove axis Axis Target Actual Offset Status Teach Target Start Calib Write Controller Module settings Mark Teaching and Theory Points Split teaching operations and theory-point management into separate tabs to reduce context switching. Mark Teaching Theory Points Configure vision parameters, manage templates, and maintain teaching points here. Teaching Operations Reference Teaching Base X Base Y Camera X Camera Y Template Name It is recommended to finish template creation and vision setup before teaching or reviewing Mark points. Theory Data Source These values are read directly from the current substrate information and are used for point generation and import validation. Point Actions Generate rule-based points from substrate data or import full-board theory coordinates from CSV. Summary After generation or import, review the point count first and then open the preview window for details. Notes Pitch X Pitch Y Rows Cols Generate from Substrate Info Import Coordinate CSV Clear Points Click “Preview Points” to inspect the complete point list in a separate window. Imported CSV files must contain Row, Col, TheoryX, and TheoryY columns. If the data does not match the substrate information, a confirmation dialog will appear. Note: Generated point data will be saved into the current substrate recipe. Preview Points Point Preview Current Point Count Point Data Details / Data Details Current visible points: Click Generate or Import to load point data. Index Point Name Row Col Theory X Theory Y Close Index Point Name Row Col Theory X Theory Y This window is read-only and only shows generated or imported theory points. Save Settings Camera Parameters File Save Settings Image Save Settings Enable Save Save Path Browse Create Folder By Date Save Up Camera Image Save Down Camera Image Save Map Camera Image Information Warning Error Confirmation An unknown error occurred. Please check the logs. Operation completed successfully. Operation failed. Save completed successfully. Substrate height measurement failed: {0} No substrate recipe is currently loaded, so substrate height measurement cannot start. The current substrate recipe does not contain height measurement point settings. No height measurement points are configured in the current substrate recipe. Height measurement point '{0}' has an invalid position configuration. Check the teach position or row/column offset settings. Save failed. Are you sure you want to delete the current data? Are you sure you want to exit the current page? The device is not initialized. Please complete initialization first. The device is busy. Please try again later. The device connection is lost. Please check the hardware or communication status. The device is not homed. Please perform homing first. The parameter is invalid. Please check the input. The parameter cannot be empty. The parameter is out of the allowed range. Please re-enter it. Are you sure you want to start the current workflow? Failed to start the workflow. Please check prerequisites and device status. The workflow is running. Are you sure you want to stop it? Failed to stop the workflow. Please try again later or check the running status. The workflow failed. The workflow failed: {0} Step [{0}] failed: {1} Substrate positioning failed: {0} The substrate recipe is not loaded. Please load a recipe first. The substrate mark parameters are not configured. Please check the recipe. No enabled substrate mark points were found in the current recipe. Please check the recipe settings. Substrate mark point [{0}] alignment failed: {1} Die positioning failed: {0} Die positioning failed because no substrate recipe is loaded. Die positioning failed because no valid die theory coordinates were found. Die positioning failed because the current wafer recipe has invalid row, column, or pitch parameters. Please check the wafer recipe. Vision camera was not found. Please check the hardware configuration. Vision camera is not open. Please open the camera first. Vision camera is not grabbing. Please prepare grabbing before capture. Vision capture timed out. Please check trigger and image stream state. Vision capture returned no frame. Vision soft trigger execution failed. Vision driver execution failed. Please check driver and camera state. Vision image object is null. Vision request is invalid. Vision timeout parameter is invalid. Vision operation was cancelled. Vision template path cannot be empty. Vision ROI parameter is invalid. Vision template MinScore is invalid. Vision template algorithm is not implemented. Vision template matching failed. Failed to open the vision template window: {0} Axis not found: {0} Failed to read position: {0} Failed to move: {0} Failed to delete axis: {0} Cannot delete axis while calibration is in progress. Calibration has been canceled. Calibration failed: {0} The controller offset write interface is not implemented yet. No writes were performed. Origin calibration configuration saved. Failed to save origin calibration configuration: {0} No calibrated modules are available for writing. All module data has been written to the controller. The controller write interface is not ready. No writes were performed. Some modules were written successfully: {0}/{1} modules. Please select a PID profile first. Please select a filtering parameter row first. Read completed successfully. Read failed. Please check logs and device status. Write completed successfully. Write failed. Please check logs and device status. Failed to load needle calibration parameters. Needle calibration touch count must be greater than 0. Needle calibration completed. Needle calibration stopped. The operation was canceled.