652 lines
45 KiB
Plaintext
652 lines
45 KiB
Plaintext
|
<ResourceDictionary xmlns="http://schemas.microsoft.com/winfx/2006/xaml/presentation"
|
|||
|
|
xmlns:x="http://schemas.microsoft.com/winfx/2006/xaml"
|
|||
|
|
xmlns:sys="clr-namespace:System;assembly=mscorlib">
|
|||
|
|
<!-- ************************************************* MaxwellFramework **************************************** -->
|
|||
|
|
|
|||
|
|
<!--Header-->
|
|||
|
|
<sys:String x:Key="PageHome">主页</sys:String>
|
|||
|
|
<sys:String x:Key="PageRecipe">配方</sys:String>
|
|||
|
|
<sys:String x:Key="PageSettings">参数设置</sys:String>
|
|||
|
|
<sys:String x:Key="PageMaintance">维护</sys:String>
|
|||
|
|
<sys:String x:Key="PageMonitor">监控</sys:String>
|
|||
|
|
<sys:String x:Key="PageSystemSetUp">系统设置</sys:String>
|
|||
|
|
<sys:String x:Key="ManualModeOperation">手动操作</sys:String>
|
|||
|
|
<sys:String x:Key="PageCalib">标定与校准</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceStatusLabel">当前状态:</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceStatusFormat">设备状态 【{0}】</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeAuto">自动运行 (AUTO)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeManual">手动调试 (MANUAL)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeMaintenance">设备维护 (MAINT)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeRecipe">配方编辑 (RECIPE)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeSettings">参数设置 (SETUP)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeCalibration">标定校准 (CALIB)</sys:String>
|
|||
|
|
<sys:String x:Key="HeaderDeviceModeUnknown">状态待定 (PENDING)</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="Carrier">方片载具</sys:String>
|
|||
|
|
<sys:String x:Key="MenuGlassPara">产品参数</sys:String>
|
|||
|
|
<sys:String x:Key="MenuWaferPara">方片参数</sys:String>
|
|||
|
|
<sys:String x:Key="MenuBondingCraftPara">工艺参数</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="MenuAxisPositionPara">轴位置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuRunPara">运行参数</sys:String>
|
|||
|
|
<sys:String x:Key="MenuBarometricPressureThresholdPara">气压阈值</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="MenuStageLogisticsMaint">载台物流组</sys:String>
|
|||
|
|
<sys:String x:Key="MenuNeedleMaint">刺晶头组</sys:String>
|
|||
|
|
<sys:String x:Key="MenuWaferPlatMaint">方片平台组</sys:String>
|
|||
|
|
<sys:String x:Key="MenuWaferFeedMaint">方片供料组</sys:String>
|
|||
|
|
<sys:String x:Key="MenuGantryMaint">龙门组</sys:String>
|
|||
|
|
<sys:String x:Key="MenuDeviceMaint">设备维护</sys:String>
|
|||
|
|
<sys:String x:Key="MenuStandardBoardMaint">标准板测试</sys:String>
|
|||
|
|
<sys:String x:Key="MenuPadPosCheckMaint">焊盘位置确认</sys:String>
|
|||
|
|
<sys:String x:Key="MenuStandardTestMaint">标准测试</sys:String>
|
|||
|
|
<sys:String x:Key="MenuNeedleDataMaint">刺晶头维护</sys:String>
|
|||
|
|
<sys:String x:Key="MenuNeedleCaliMaint">刺晶头校正</sys:String>
|
|||
|
|
<sys:String x:Key="MenuHeightMaint">设备基准高度标定</sys:String>
|
|||
|
|
<sys:String x:Key="MenuVersionManagerMaint">版本管理</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="MenuIOMonitor">IO状态</sys:String>
|
|||
|
|
<sys:String x:Key="MenuAxisStateMonitor">轴状态</sys:String>
|
|||
|
|
<sys:String x:Key="MenuMotionMonitor">流程状态</sys:String>
|
|||
|
|
<sys:String x:Key="MenuTTMonitor">TT统计</sys:String>
|
|||
|
|
<sys:String x:Key="MenuDieBonding">数据分析</sys:String>
|
|||
|
|
<sys:String x:Key="MenuCycleMaintenance">周期保养</sys:String>
|
|||
|
|
<sys:String x:Key="MenuControllerMonitor">控制器监控</sys:String>
|
|||
|
|
<sys:String x:Key="MenuAtmosphericPressureState">气压状态</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="MenuWSRotateCenterCali">WS中心校验</sys:String>
|
|||
|
|
<sys:String x:Key="MenuParaCaliSys">视觉标定</sys:String>
|
|||
|
|
<sys:String x:Key="MenuCameraParaCaliSys">相机标定</sys:String>
|
|||
|
|
<sys:String x:Key="AxisOriginCalib">轴系零点标定</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibMonitorTitle">图像</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibSaveConfig">保存配置</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibResetAll">全部复位</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibWriteAll">一键写入控制器</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibModuleLabel">模块</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibBadgeIndependent">独立</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibBadgeAvoidance">避让</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibAvoidanceHeader">避让配置 (SAFE)</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibAddAvoidanceAxis">添加避让轴</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibAxisName">轴名称</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibTeachAvoidancePosition">示教避让位置</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibRemoveAxis">删除该轴</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibAxisHeader">标定轴</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibTargetHeader">示教点</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibActualHeader">实际位置</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibOffsetHeader">偏差</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibStatusHeader">状态</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibTeachTarget">示教点位</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibStartCalib">开始标定</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibWriteController">写入控制器</sys:String>
|
|||
|
|
<sys:String x:Key="OriginCalibModuleSettings">模块设置</sys:String>
|
|||
|
|
<sys:String x:Key="CameraDistortionCorrectionCalib">相机畸变标定</sys:String>
|
|||
|
|
<sys:String x:Key="MenuMotionCaliSys">运动系标置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuMotionCaliWSSys">运动系WS标定</sys:String>
|
|||
|
|
<sys:String x:Key="KinematicSystemAngleCali">运动系角度标置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuRotateCenterCaliSys">旋转中心标定</sys:String>
|
|||
|
|
<sys:String x:Key="MenuWSRotateCenterCaliSys">WS干涉中心标定</sys:String>
|
|||
|
|
<sys:String x:Key="CameraFusionCali02ASys">相机融合标定</sys:String>
|
|||
|
|
<sys:String x:Key="CameraLaserCaliSys">测距仪相机标置</sys:String>
|
|||
|
|
<sys:String x:Key="CVMaterialFlow">物流设置</sys:String>
|
|||
|
|
<sys:String x:Key="PLCAxisSetting">PLC轴设置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuEquipmentParaSys">厂商设置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuControlParaSys">控制参数设置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuPIDParaSys">PID设置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuSpeedParaSys">速度规划</sys:String>
|
|||
|
|
<sys:String x:Key="Menu27HZMotionParaSys">刺晶头运动设置</sys:String>
|
|||
|
|
<sys:String x:Key="MenuAgingTestParaSys">老化测试</sys:String>
|
|||
|
|
<sys:String x:Key="MenuCreatPadCSVParaSys">生成文件</sys:String>
|
|||
|
|
<sys:String x:Key="MenuLogTest">日志测试</sys:String>
|
|||
|
|
<sys:String x:Key="ID">ID</sys:String>
|
|||
|
|
<sys:String x:Key="VerifiyResult">结果验证</sys:String>
|
|||
|
|
<sys:String x:Key="Start">开始</sys:String>
|
|||
|
|
<sys:String x:Key="Stop">停止</sys:String>
|
|||
|
|
<sys:String x:Key="MakeModel">模版制作</sys:String>
|
|||
|
|
<sys:String x:Key="VisionParSet">视觉参数设置</sys:String>
|
|||
|
|
<sys:String x:Key="TeachPos">获取当前位置</sys:String>
|
|||
|
|
<sys:String x:Key="MoveToCurrentPos">移动到此位置</sys:String>
|
|||
|
|
<sys:String x:Key="CameraPar">相机参数</sys:String>
|
|||
|
|
<sys:String x:Key="LightSetting">光源设置</sys:String>
|
|||
|
|
<sys:String x:Key="GetParameter">参数获取</sys:String>
|
|||
|
|
|
|||
|
|
<!--#region ToolBox -->
|
|||
|
|
<sys:String x:Key="ToolBox">工具箱</sys:String>
|
|||
|
|
<sys:String x:Key="MainAxisHome">主轴回零</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 配方相关 -->
|
|||
|
|
<sys:String x:Key="BaseSetting">基础设置</sys:String>
|
|||
|
|
<sys:String x:Key="Description">描述</sys:String>
|
|||
|
|
<sys:String x:Key="InUse">启用</sys:String>
|
|||
|
|
<sys:String x:Key="RecipeList">配方列表</sys:String>
|
|||
|
|
<sys:String x:Key="Open">打开</sys:String>
|
|||
|
|
<sys:String x:Key="Apply">应用</sys:String>
|
|||
|
|
<sys:String x:Key="New">新建</sys:String>
|
|||
|
|
<sys:String x:Key="Copy">复制</sys:String>
|
|||
|
|
<sys:String x:Key="ReName">重命名</sys:String>
|
|||
|
|
<sys:String x:Key="Clear">清空</sys:String>
|
|||
|
|
<sys:String x:Key="Delete">删除</sys:String>
|
|||
|
|
<sys:String x:Key="Add">添加</sys:String>
|
|||
|
|
<sys:String x:Key="Import">导入</sys:String>
|
|||
|
|
<sys:String x:Key="Export">导出</sys:String>
|
|||
|
|
<sys:String x:Key="Save">保存</sys:String>
|
|||
|
|
<sys:String x:Key="CreateRecipe">新建配方</sys:String>
|
|||
|
|
<sys:String x:Key="ReNameRecipe">重命名配方</sys:String>
|
|||
|
|
<sys:String x:Key="LogisticsInfo">物流设置</sys:String>
|
|||
|
|
<sys:String x:Key="CarrierInfo">载具信息</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateInfo">基板信息</sys:String>
|
|||
|
|
<sys:String x:Key="WaferInfo">芯片信息</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateSelect">基板设置</sys:String>
|
|||
|
|
<sys:String x:Key="CarrierWidth">载具长度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="CarrierHeight">载具宽度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="CarrierThickness">载具厚度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateWidth">基板长度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeight">基板宽度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateThickness">基板厚度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateRowNum">基板行数(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateColNum">基板列数(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstratePitchX">像素X间距(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstratePitchY">像素Y间距(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstratePiexlWidth">像素长度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstratePiexlHeight">像素宽度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateRecipe">基板配方</sys:String>
|
|||
|
|
<sys:String x:Key="WaferRecipesSelect">芯片配方选择</sys:String>
|
|||
|
|
<sys:String x:Key="WaferRecipe">芯片配方</sys:String>
|
|||
|
|
<sys:String x:Key="DieSizeX">芯片SizeX(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="DieSizeY">芯片SizeY(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="DiePitchX">芯片X间距(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="DiePitchY">芯片Y间距(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="DieColor">芯片种类:</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateOffsetX">基板坐标偏移X</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateOffsetY">基板坐标偏移Y</sys:String>
|
|||
|
|
<sys:String x:Key="WaferWidth">Wafer长度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="WaferHeight">Wafer宽度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="WaferThickness">膜厚(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="WaferRowNum">Wafer行数(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="WaferColNum">Wafer列数(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CameraNotFound">视觉相机未找到，请检查硬件配置。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CameraNotOpen">视觉相机未打开，请先打开相机。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CameraNotGrabbing">视觉相机未处于抓流状态，请先准备抓流。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CaptureTimeout">视觉采图超时，请检查触发与图像流状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_NoFrameReturned">视觉采图未返回图像帧。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_SoftTriggerFailed">视觉软触发执行失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_DriverError">视觉驱动执行失败，请检查驱动和相机状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_ImageIsNull">视觉图像对象为空。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_RequestInvalid">视觉请求参数无效。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TimeoutInvalid">视觉超时参数无效。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_OperationCancelled">视觉操作已取消。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TemplatePathEmpty">视觉模板路径不能为空。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TemplateRoiInvalid">视觉 ROI 参数无效。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TemplateMinScoreInvalid">视觉模板 MinScore 参数无效。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TemplateAlgorithmNotImplemented">视觉模板算法尚未实现。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_TemplateMatchFailed">视觉模板匹配失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CommonAlgorithmNotSupported">视觉通用算法类型不受支持。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_CommonAlgorithmExecutionFailed">视觉通用算法执行失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Vision_ChipMapSortInputInvalid">芯片 Map 排序输入无效。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_OpenVisionTemplateFailed">打开视觉模板制作窗口失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_AxisNotFound">未找到轴：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ReadPositionFailed">读取位置失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_MoveFailed">移动失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_DeleteAxisFailed">删除轴失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_DeleteAxisDuringCalibration">当前标定中，不能删除轴。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_CalibrationCanceled">标定已取消。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_CalibrationFailed">标定失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ControllerWriteNotImplemented">控制器偏移写入接口尚未实现，未执行任何写入。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ConfigSaved">原点标定配置已保存。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ConfigSaveFailed">保存原点标定配置失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_NoCalibratedModules">没有可写入的已标定模块。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ControllerWriteCompleted">已将所有模块数据写入控制器。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ControllerWriteNotReady">控制器写入接口尚未接入，本次未执行任何写入。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_OriginCalib_ControllerWritePartialSuccess">部分模块写入成功，已写入 {0}/{1} 个模块。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_NoProfileSelected">请先选择一个 PID 配置组。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_NoFilteringParameterSelected">请先选择一个滤波参数行。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_ReadSucceeded">读取成功。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_ReadFailed">读取失败，请检查日志与设备状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_WriteSucceeded">写入成功。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Pid_WriteFailed">写入失败，请检查日志与设备状态。</sys:String>
|
|||
|
|
<!--#endregion -->
|
|||
|
|
|
|||
|
|
<!--#region 光源设置-->
|
|||
|
|
<sys:String x:Key="PointRedLight">点红光：</sys:String>
|
|||
|
|
<sys:String x:Key="PointBlueLight">点蓝光：</sys:String>
|
|||
|
|
<sys:String x:Key="RingRedLight">环红光：</sys:String>
|
|||
|
|
<sys:String x:Key="RingBlueLight">环蓝光：</sys:String>
|
|||
|
|
<sys:String x:Key="RedBackLight">红背光：</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 轴坐标设定-->
|
|||
|
|
<sys:String x:Key="PositionTeach">坐标示教</sys:String>
|
|||
|
|
<sys:String x:Key="MoveToPosition">移动到此位置</sys:String>
|
|||
|
|
<sys:String x:Key="Move">移动</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
<!--#region 基板定位-->
|
|||
|
|
<sys:String x:Key="SubstratePosition">基板定位</sys:String>
|
|||
|
|
<sys:String x:Key="MarkResult">定位结果</sys:String>
|
|||
|
|
<sys:String x:Key="BaseX">基准X</sys:String>
|
|||
|
|
<sys:String x:Key="BaseY">基准Y</sys:String>
|
|||
|
|
<sys:String x:Key="ResultX">结果X</sys:String>
|
|||
|
|
<sys:String x:Key="ResultY">结果Y</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateRow">基板行号：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateCol">基板列号：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateAngle">基板角度</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateMap">基板Map</sys:String>
|
|||
|
|
<sys:String x:Key="AllowClickSelection">允许点击选择</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualSummary">测高摘要</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualRecipeName">当前基板配方：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualMode">测高模式：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualConfiguredCount">配置点位数：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualMeasuredCount">已测点位数：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualResultList">测高结果</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualPointName">点位名称</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualRow">行号</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualColumn">列号</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualPositionX">位置 X</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualPositionY">位置 Y</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualHeightValue">测高值</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualTeachMode">标准示教位置</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasureManualRowColumnMode">行列坐标 + 偏移补偿</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckSummary">复检摘要</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckRegion">复检区域</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckRegionEditorTitle">复检区域设置</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckPointCount">当前复检点数：</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckVisiblePointCount">当前显示点数：</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckCurrentPoints">当前复检点位</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckFunctionGroup">功能分组</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckThresholdSectionTitle">1. 设置全局阈值参数 (mm)</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckXThresholdSetting">X 轴阈值设定</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckYThresholdSetting">Y 轴阈值设定</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckRuleSectionTitle">2. 选择筛选规则</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckFilterMissingBond">仅显示漏固</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckFilterXYThreshold">仅显示 X、Y 同时超阈值</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckFilterXThreshold">仅显示 X 轴超过当前阈值</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckFilterYThreshold">仅显示 Y 轴超过当前阈值</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckMoveToSelectedPoint">移动到复检点</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckResetFilters">重置筛选</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckStepIndex">序号</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckPadRow">基板行</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckPadColumn">基板列</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckDieRow">芯片行</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckDieColumn">芯片列</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckPadX">基板 X</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckPadY">基板 Y</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckDieX">芯片 X</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckDieY">芯片 Y</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckXError">X 偏差</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckYError">Y 偏差</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckStatus">状态</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecheckType">路径类型</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_SelectedPointRequired">请先选中一个复检点位。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_MoveDeviceUnavailable">当前相机轴设备未就绪，无法移动到选中复检点。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_StatusOk">OK</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_StatusMissingBond">漏固</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_StatusXExceeded">X超差({0:F4})</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_DieRecheck_StatusYExceeded">Y超差({0:F4})</sys:String>
|
|||
|
|
<sys:String x:Key="MarkModel">Mark模版</sys:String>
|
|||
|
|
<sys:String x:Key="AddMark">添加Mark点</sys:String>
|
|||
|
|
<sys:String x:Key="DeleteMark">删除Mark点</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachPageTitle">Mark示教与理论点位</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachPageSubtitle">将示教操作与理论点位管理拆分到不同页签，减少跨任务切换负担。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachTabTeach">Mark示教</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachTabCoordinate">理论点位</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachTeachSectionHint">用于配置视觉参数、制作模板并维护示教点位。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachOperationsHeader">示教操作</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachReferenceTeach">基准示教</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachBaseX">Base X</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachBaseY">Base Y</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCameraX">Camera X</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCameraY">Camera Y</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachTemplateName">模板名称</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachTeachBottomHint">建议先完成模板制作与视觉参数配置，再对 Mark 点进行增删、示教和复核。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateSourceHeader">理论数据源</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateSourceHint">以下参数直接读取当前基板信息，用作理论点位生成和导入校验的依据。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateActionHeader">点位操作</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateActionHint">可根据当前基板信息生成规则点位，也可从 CSV 导入整板理论坐标。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateSummaryHeader">结果摘要</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateSummaryHint">生成或导入后可先查看点位数量，再打开预览窗口核对详情。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateDescriptionHeader">说明</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachPitchX">Pitch X</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachPitchY">Pitch Y</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachRows">Rows</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCols">Cols</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachGenerateCoordinates">基板信息生成</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachImportCoordinates">导入坐标 CSV</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachClearCoordinates">清空点位</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateDescription">点击“预览点位”可在独立窗口中查看完整点位列表。导入 CSV 时需包含 Row、Col、TheoryX、TheoryY 列，若与基板信息不匹配，会提示是否继续导入。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinatePersistenceHint">提示：生成后的点位数据会保存在当前基板配方中。</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewOpen">预览点位</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewWindowTitle">点位预览</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewPointCountLabel">当前点位数量</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateDetailsHeader">点位数据详情 / Data Details</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateCurrentDisplayCount">当前显示点数: </sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateEmptyHint">请点击“生成”或“导入”按钮以加载点位数据</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateIndex">序号</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinatePointName">点位名称</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateRowHeader">行 (Row)</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateColHeader">列 (Col)</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateTheoryX">理论 X</sys:String>
|
|||
|
|
<sys:String x:Key="MarkTeachCoordinateTheoryY">理论 Y</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewClose">关闭</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewIndex">序号</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewPointName">点位名称</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewRow">行</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewCol">列</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewTheoryX">理论 X</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewTheoryY">理论 Y</sys:String>
|
|||
|
|
<sys:String x:Key="MarkCoordinatePreviewReadOnlyTip">该窗口仅用于查看生成或导入后的理论点位，不会修改原始数据。</sys:String>
|
|||
|
|
|
|||
|
|
<!--#region 程序弹窗多语言 -->
|
|||
|
|
<sys:String x:Key="Msg_Title_Info">提示</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Title_Warning">警告</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Title_Error">错误</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Title_Confirm">确认</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="Msg_Common_UnknownError">发生未知错误，请检查日志信息。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_OperationSucceeded">操作成功。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_OperationFailed">操作失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_SaveSucceeded">保存成功。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_SaveFailed">保存失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_SaveConfirm">是否保存轴软限位设置？</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_SaveFailedWithReason">保存轴软限位设置失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_LoadFailedWithReason">加载轴软限位设置失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_RangeInvalid">轴 {0} 的正软限位不能小于负软限位。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_ApplySucceeded">轴 {0} 的软限位已下发到底层控制器。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_ApplyFailedWithReason">轴 {0} 的软限位下发失败：{1}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_ApplyAllSucceeded">已成功下发全部轴软限位，共 {0} 轴。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_ApplyAllFailedWithReason">下发全部轴软限位失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_NoAxisData">当前没有可下发的轴软限位数据。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_AxisSoftLimit_SelectedAxisRequired">请先选择一条轴软限位数据。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_DeleteConfirm">确认删除当前数据吗？</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Common_ExitConfirm">确认退出当前页面吗？</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="Msg_Device_NotInitialized">设备未初始化，请先完成初始化操作。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Device_Busy">设备忙碌中，请稍后再试。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Device_Disconnected">设备连接已断开，请检查硬件或通讯状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Device_HomeRequired">设备未回零，请先执行回零操作。</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="Msg_Param_Invalid">参数无效，请检查输入内容。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Param_Empty">参数不能为空。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Param_OutOfRange">参数超出允许范围，请重新输入。</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="Msg_Process_StartConfirm">确认启动当前流程吗？</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_StartFailed">流程启动失败，请检查前置条件和设备状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_StopConfirm">当前流程正在运行，确认停止吗？</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_StopFailed">流程停止失败，请稍后重试或检查运行状态。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_Failed">流程失败。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_FailedWithReason">流程失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_StepFailedWithReason">步骤 [{0}] 执行失败：{1}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_SubstratePositionFailedWithReason">基板定位失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_SubstratePositionRecipeNotLoaded">未加载基板配方，请先加载配方。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_SubstratePositionMarkParameterMissing">基板 Mark 参数未配置，请检查配方。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_SubstratePositionNoEnabledMarks">当前配方中没有启用的基板 Mark 点，请检查配方设置。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_SubstratePositionAlignmentFailedWithReason">基板 Mark 点 [{0}] 对齐失败：{1}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_DiePositionFailedWithReason">芯片定位失败：{0}</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_DiePositionRecipeNotLoaded">芯片定位失败，当前未加载基板配方。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_DiePositionCoordinateGenerationMissing">芯片定位失败，未找到可用的芯片理论坐标。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_Process_DiePositionWaferInfoMissing">芯片定位失败，当前晶圆配方中的行列或 Pitch 参数无效，请检查晶圆配方。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_NeedleCalibration_LoadFailed">未能加载对刀参数。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_NeedleCalibration_TouchCountMustGreaterThanZero">对刀次数必须大于 0。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_NeedleCalibration_Completed">对刀完成。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_NeedleCalibration_Stopped">对刀已停止。</sys:String>
|
|||
|
|
<sys:String x:Key="Msg_NeedleCalibration_Canceled">操作已取消。</sys:String>
|
|||
|
|
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 芯片拉直-->
|
|||
|
|
<sys:String x:Key="ChipStraightening">芯片拉直</sys:String>
|
|||
|
|
<sys:String x:Key="ChipAngle">芯片角度</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!-- #region DiePosition-->
|
|||
|
|
<sys:String x:Key="DiePosition">芯片定位</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionStatistics">统计结果</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionTotalDieCountLabel">总芯片数量:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionPassRateLabel">合格占比:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionOkDieCountLabel">OK芯片数量:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionNgDieCountLabel">NG芯片数量:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionAverageSpacingXLabel">X方向平均间距:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionAverageSpacingYLabel">Y方向平均间距:</sys:String>
|
|||
|
|
<sys:String x:Key="DiePositionMap">芯片Map</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!-- #region LaserCompensation-->
|
|||
|
|
<sys:String x:Key="LaserCompensationParameters">激光补偿参数</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationStartPosition">起始位</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationStepDistance">步距</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationStepCount">步距次数</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationJumpPosition">跳程</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationCycleCount">循环次数</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationDelaySeconds">延时(s)</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationExecutionControl">执行控制</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationTrajectoryOrder">轨迹顺序：预备位 -> 正向测量点 -> 过冲位 -> 反向测量点 -> 预备位</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationExecutionStatus">执行状态</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationCurrentCycle">当前循环</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationCurrentPoint">当前点位</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationCurrentTarget">当前目标</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationDescriptionPrimary">程序运行时会按：预备位 -> 测量点正向 -> 过冲位 -> 测量点反向 -> 预备位 的序列执行绝对运动，并在每个点位到位后进行异步延时。</sys:String>
|
|||
|
|
<sys:String x:Key="LaserCompensationDescriptionSecondary">运行期间界面仅保留停止按钮可用，便于快速中断。</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
|
|||
|
|
<!-- #region Wafer拉直-->
|
|||
|
|
<sys:String x:Key="WaferAngleAdjustment">方片角度调整</sys:String>
|
|||
|
|
<sys:String x:Key="WaferAngleResult">方片拉直结果</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!-- #region DieBonding-->
|
|||
|
|
<sys:String x:Key="DieBondingSet">转移设置</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingPath">转移路径</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateRegion">基板区域</sys:String>
|
|||
|
|
<sys:String x:Key="WaferRegion">芯片区域</sys:String>
|
|||
|
|
<sys:String x:Key="GenerateSet">生成设置</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingGenerateModeLabel">生成模式：</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingPadRowDirectionLabel">基板行方向：</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingDieRowDirectionLabel">晶圆行方向：</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingAutoCalculateDieLabel">自动计算芯片：</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingSequenceNumberHeader">序号</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingSubstrateRowHeader">基板行</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingSubstrateColumnHeader">基板列</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingWaferRowHeader">晶圆行</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingWaferColumnHeader">晶圆列</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingTypeHeader">类型</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingMoveToDieButton">移动到芯片</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingMoveToPadButton">移动到焊盘</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingAlignDieToPadButton">芯片对齐焊盘</sys:String>
|
|||
|
|
<sys:String x:Key="DieBondingGeneratePathButton">生成转移路径</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 设备运行参数-->
|
|||
|
|
<sys:String x:Key="ProduceControl">流程控制</sys:String>
|
|||
|
|
<sys:String x:Key="BondingControl">转移控制</sys:String>
|
|||
|
|
<sys:String x:Key="ThresholdParameters">阈值参数</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessParameterSettings">流程参数设置</sys:String>
|
|||
|
|
<sys:String x:Key="SpeedParameters">速度参数</sys:String>
|
|||
|
|
<sys:String x:Key="GlobalRunParameters">全局运行参数</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabProductLoad">产品上料</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabProductUnload">产品下料</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabProductPosition">产品定位</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabProductHeightMeasure">产品高度测量</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabWaferLoad">方片上料</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabWaferUnload">方片下料</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabWaferStraighten">方片拉直</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabDieRecognize">晶粒飞拍</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabBonding">转移作业</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessTabRecheck">复检</sys:String>
|
|||
|
|
<sys:String x:Key="ProcessControlGroup">流程控制</sys:String>
|
|||
|
|
<sys:String x:Key="PositionThresholdGroup">定位阈值</sys:String>
|
|||
|
|
<sys:String x:Key="StraightenThresholdGroup">拉直阈值</sys:String>
|
|||
|
|
<sys:String x:Key="DieRecognizeStrategyGroup">飞拍策略</sys:String>
|
|||
|
|
<sys:String x:Key="BondingPathStrategyGroup">转移路径策略</sys:String>
|
|||
|
|
<sys:String x:Key="BondingProcessParameterGroup">转移工艺参数</sys:String>
|
|||
|
|
<sys:String x:Key="AdaptiveFastBondingGroup">自适应快打参数</sys:String>
|
|||
|
|
<sys:String x:Key="EnableProductLoad">启用产品上料</sys:String>
|
|||
|
|
<sys:String x:Key="EnableProductUnload">启用产品下料</sys:String>
|
|||
|
|
<sys:String x:Key="EnableProductPosition">启用产品定位</sys:String>
|
|||
|
|
<sys:String x:Key="EnableProductHeightMeasureFlow">启用高度测量流程</sys:String>
|
|||
|
|
<sys:String x:Key="EnableProductHeightMeasure">启用高度测量</sys:String>
|
|||
|
|
<sys:String x:Key="EnableWaferLoad">启用方片上料</sys:String>
|
|||
|
|
<sys:String x:Key="EnableWaferUnload">启用方片下料</sys:String>
|
|||
|
|
<sys:String x:Key="EnableWaferStraighten">启用方片拉直</sys:String>
|
|||
|
|
<sys:String x:Key="EnableDieRecognize">启用晶粒飞拍</sys:String>
|
|||
|
|
<sys:String x:Key="EnableBondingProcess">启用转移作业</sys:String>
|
|||
|
|
<sys:String x:Key="EnableRecheckProcess">启用复检流程</sys:String>
|
|||
|
|
<sys:String x:Key="XAxisDirectionLabel">X方向</sys:String>
|
|||
|
|
<sys:String x:Key="WaferScanModeLabel">芯片扫描模式：</sys:String>
|
|||
|
|
<sys:String x:Key="ZScanMode">Z型扫描</sys:String>
|
|||
|
|
<sys:String x:Key="PoseOptimization">点位优化</sys:String>
|
|||
|
|
<sys:String x:Key="BondingSubstratePathMode">基板路径模式：</sys:String>
|
|||
|
|
<sys:String x:Key="BondingRegionModeLabel">区域换行模式：</sys:String>
|
|||
|
|
<sys:String x:Key="BondingWaferModeLabel">晶圆换行模式：</sys:String>
|
|||
|
|
<sys:String x:Key="BondingRegionPatternMode">是否按区域打件：</sys:String>
|
|||
|
|
<sys:String x:Key="RegionModeLabel">区域模式</sys:String>
|
|||
|
|
<sys:String x:Key="BondingSubstrateSPath">基板S形</sys:String>
|
|||
|
|
<sys:String x:Key="BondingSubstrateXReverse">基板X反向</sys:String>
|
|||
|
|
<sys:String x:Key="BondingSubstrateYReverse">基板Y反向</sys:String>
|
|||
|
|
<sys:String x:Key="BondingWaferSPath">晶圆S形</sys:String>
|
|||
|
|
<sys:String x:Key="BondingWaferXReverse">晶圆X反向</sys:String>
|
|||
|
|
<sys:String x:Key="BondingWaferYReverse">晶圆Y反向</sys:String>
|
|||
|
|
<sys:String x:Key="BondingByYDirection">按Y方向补打</sys:String>
|
|||
|
|
<sys:String x:Key="BondingFastRateLabel">每行快打率：</sys:String>
|
|||
|
|
<sys:String x:Key="BondingGlassNumLabel">产品数量：</sys:String>
|
|||
|
|
<sys:String x:Key="BondingVirtualNumLabel">假点数量：</sys:String>
|
|||
|
|
<sys:String x:Key="UseAllDieLabel">晶粒100%消耗：</sys:String>
|
|||
|
|
<sys:String x:Key="AirCoolAllProduceLabel">全程气冷：</sys:String>
|
|||
|
|
<sys:String x:Key="EnabledLabel">启用</sys:String>
|
|||
|
|
<sys:String x:Key="AdaptiveFrequencyLabel">自适应频率</sys:String>
|
|||
|
|
<sys:String x:Key="MinWaferRegionFastBondingLabel">小区域快打</sys:String>
|
|||
|
|
<sys:String x:Key="MinWaferRegionLowFrequencyLabel">小区域降频</sys:String>
|
|||
|
|
<sys:String x:Key="MinWaferRegionColumnLabel">小区域列数阈值：</sys:String>
|
|||
|
|
<sys:String x:Key="MinWaferRegionFrequencyLabel">小区域快打频率：</sys:String>
|
|||
|
|
<sys:String x:Key="FirstSelectedFrequencyLabel">1档频率：</sys:String>
|
|||
|
|
<sys:String x:Key="SecondSelectedFrequencyLabel">2档频率：</sys:String>
|
|||
|
|
<sys:String x:Key="FirstSelectedThresholdLabel">1档阈值：</sys:String>
|
|||
|
|
<sys:String x:Key="SecondSelectedThresholdLabel">2档阈值：</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="SpeedSetting">速度设置</sys:String>
|
|||
|
|
<sys:String x:Key="SpeedMode">速度模式</sys:String>
|
|||
|
|
<sys:String x:Key="ChangeSingleData">修改单条数据</sys:String>
|
|||
|
|
<sys:String x:Key="ChangeAllData">修改所有数据</sys:String>
|
|||
|
|
<sys:String x:Key="ChangeMainData">修改龙门数据</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="AxisName">轴名称</sys:String>
|
|||
|
|
<sys:String x:Key="Speed">速度</sys:String>
|
|||
|
|
<sys:String x:Key="Acc">加速度</sys:String>
|
|||
|
|
<sys:String x:Key="Dec">减速度</sys:String>
|
|||
|
|
<sys:String x:Key="Jerk">加加速度</sys:String>
|
|||
|
|
<sys:String x:Key="HighPercent">高速</sys:String>
|
|||
|
|
<sys:String x:Key="MedianPercent">中速</sys:String>
|
|||
|
|
<sys:String x:Key="LowPercent">低速</sys:String>
|
|||
|
|
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
|
|||
|
|
<!--#region 设备点位-->
|
|||
|
|
<sys:String x:Key="WaferAllPosition">方片相关位置</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateAllPosition">基板相关位置</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 设备基本参数-->
|
|||
|
|
<sys:String x:Key="MenuMaterialBoxPara">料盒参数</sys:String>
|
|||
|
|
<sys:String x:Key="MenuAxisParameters">轴参数设置</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitGroupHeader">轴软限位设置</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitFilePathLabel">配置文件</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitCardName">控制卡名称</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitCardNum">卡号</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitAxisNum">轴号</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitNegativeLabel">负软限位</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitPositiveLabel">正软限位</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitApplyAllButton">设定所有轴</sys:String>
|
|||
|
|
<sys:String x:Key="AxisSoftLimitApplyButton">设定</sys:String>
|
|||
|
|
<sys:String x:Key="FileSavePara">保存设置</sys:String>
|
|||
|
|
<sys:String x:Key="CameraPara">相机参数</sys:String>
|
|||
|
|
<sys:String x:Key="OtherPara">其他参数</sys:String>
|
|||
|
|
<sys:String x:Key="FovPara">相机视场角</sys:String>
|
|||
|
|
<sys:String x:Key="FovX">FovX</sys:String>
|
|||
|
|
<sys:String x:Key="FovY">FovY</sys:String>
|
|||
|
|
<sys:String x:Key="FileRelatedSaveSetting">文件相关保存设置</sys:String>
|
|||
|
|
<sys:String x:Key="ImageRelatedSaveSetting">图片相关保存设置</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationSaveEnable">启用保存</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationSavePath">保存路径</sys:String>
|
|||
|
|
<sys:String x:Key="Browse">浏览</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationCreateDateFolder">按日期创建文件夹</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationSaveUpCameraImage">保存上相机图片</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationSaveDownCameraImage">保存下相机图片</sys:String>
|
|||
|
|
<sys:String x:Key="DeviceFoundationSaveMapCameraImage">保存Map相机图片</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 硬件测试-->
|
|||
|
|
<sys:String x:Key="Diastimeter">测距仪</sys:String>
|
|||
|
|
<sys:String x:Key="DiastimeterValue">测距显示值</sys:String>
|
|||
|
|
<sys:String x:Key="SetZero">置零</sys:String>
|
|||
|
|
<sys:String x:Key="GetCurrentValue">获取当前值</sys:String>
|
|||
|
|
<sys:String x:Key="GlassScaner">基板扫码枪</sys:String>
|
|||
|
|
<sys:String x:Key="WaferScaner">方片扫码枪</sys:String>
|
|||
|
|
<sys:String x:Key="FFURotateSpeed">风机转速</sys:String>
|
|||
|
|
<sys:String x:Key="Close">关闭</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 设备运行参数-->
|
|||
|
|
<sys:String x:Key="RecheckSetting">复检设置</sys:String>
|
|||
|
|
<sys:String x:Key="IrregularRecheck">不规则复检</sys:String>
|
|||
|
|
<sys:String x:Key="ProduceTest">生产检测</sys:String>
|
|||
|
|
<sys:String x:Key="WholeMachineAging">整机老化</sys:String>
|
|||
|
|
<sys:String x:Key="ChipRecognizeSetting">晶粒飞拍设置</sys:String>
|
|||
|
|
<sys:String x:Key="ChipStraightSetting">方片拉直设置</sys:String>
|
|||
|
|
<sys:String x:Key="DieAngleThreshold">晶粒角度阈值X：</sys:String>
|
|||
|
|
<sys:String x:Key="StraightAngleDirX">拉直方向X：</sys:String>
|
|||
|
|
<sys:String x:Key="MaxBadDieCount">Die异常点阈值：</sys:String>
|
|||
|
|
<sys:String x:Key="GlassMarkDisMaxOffset">标识距离偏差:</sys:String>
|
|||
|
|
<sys:String x:Key="HeightMeasureLimit">测高补偿界限：</sys:String>
|
|||
|
|
<sys:String x:Key="PcbLimitAngle">PCB角度阈值：</sys:String>
|
|||
|
|
<sys:String x:Key="IsUseGlassRePosition">换料产品定位：</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="OtherProduceSettting">其他流程设置</sys:String>
|
|||
|
|
<sys:String x:Key="GlobalRunFeatureSettings">全局运行功能</sys:String>
|
|||
|
|
<sys:String x:Key="GlobalRunModeSettings">运行模式设置</sys:String>
|
|||
|
|
<sys:String x:Key="NeedleCheck">对刀检查：</sys:String>
|
|||
|
|
<sys:String x:Key="SubstrateHeightMeasure">基板高度测量</sys:String>
|
|||
|
|
<sys:String x:Key="UseHeightOffset">测高补偿：</sys:String>
|
|||
|
|
<sys:String x:Key="ChangePid">飞拍PID切换:</sys:String>
|
|||
|
|
<sys:String x:Key="UseMes">Mes启用：</sys:String>
|
|||
|
|
<sys:String x:Key="NeedleCheckBondingGlassNum">对刀检查数量：</sys:String>
|
|||
|
|
<sys:String x:Key="GlassMarkRecheck">Mark复检：</sys:String>
|
|||
|
|
<sys:String x:Key="SolidWeightCheck">固重检测:</sys:String>
|
|||
|
|
<sys:String x:Key="SingleStraighten">单次拉直定位：</sys:String>
|
|||
|
|
<sys:String x:Key="SingleWaferPosition">单次芯片定位：</sys:String>
|
|||
|
|
<sys:String x:Key="WaferWaveCheck">波长检查启用：</sys:String>
|
|||
|
|
|
|||
|
|
<sys:String x:Key="IsNeedleUpWhenBonding">针是否抬高</sys:String>
|
|||
|
|
<sys:String x:Key="IsUseFastBonding">是否快打</sys:String>
|
|||
|
|
<sys:String x:Key="IsUseReBonding">是否补打</sys:String>
|
|||
|
|
<sys:String x:Key="BondingSetting">打件设置</sys:String>
|
|||
|
|
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region 维护-->
|
|||
|
|
<sys:String x:Key="DieThickness">晶粒厚度(mm):</sys:String>
|
|||
|
|
<sys:String x:Key="CZCalibrationHeight">SZ标定高度:</sys:String>
|
|||
|
|
<sys:String x:Key="StageDatumHeight">StagePlatform标定高度：</sys:String>
|
|||
|
|
<sys:String x:Key="WSAvoidancePosition">龙门2避让位:</sys:String>
|
|||
|
|
<sys:String x:Key="ReadPosition">读取当前位置</sys:String>
|
|||
|
|
<sys:String x:Key="MovePosition">移动到位</sys:String>
|
|||
|
|
<sys:String x:Key="LaserToCaliStage">激光打对刀仪测量点：</sys:String>
|
|||
|
|
<sys:String x:Key="HeightMeasure">高度测量</sys:String>
|
|||
|
|
<sys:String x:Key="WaferHeightMeasure">方片高度测量</sys:String>
|
|||
|
|
<sys:String x:Key="Id">序号</sys:String>
|
|||
|
|
<sys:String x:Key="X">X(mm)</sys:String>
|
|||
|
|
<sys:String x:Key="Y">Y(mm)</sys:String>
|
|||
|
|
<sys:String x:Key="Z">Z(mm)</sys:String>
|
|||
|
|
<sys:String x:Key="Height">Height(mm)</sys:String>
|
|||
|
|
<sys:String x:Key="Gap2">Gap2</sys:String>
|
|||
|
|
<sys:String x:Key="StageBaseHeight">StagePlatform基准高度:</sys:String>
|
|||
|
|
<sys:String x:Key="NeedleTouchWaferZHeight">刺晶头接触到方片高度:</sys:String>
|
|||
|
|
<sys:String x:Key="LaserToZ1Offset">激光与刺晶头偏差:</sys:String>
|
|||
|
|
<sys:String x:Key="Calculate">计算</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
|
|||
|
|
<!--#region MwMessageBox 对话框-->
|
|||
|
|
<sys:String x:Key="MwMessageBoxDefaultCaption">系统提示</sys:String>
|
|||
|
|
<!--#endregion-->
|
|||
|
|
</ResourceDictionary>
|