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test_demo/MX-PD-盘古 - new/PanGu.DieBonderApp/Configuration/WaferHandlingFlow.json

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{
"Nodes": [
{
"Key": "WaferLoad",
"DisplayName": "晶圆上料",
"ActivityKeywords": [
"ChipLoad",
"ChipLoadExecute"
],
"WorkflowKeywords": [],
"ParentKeywords": []
},
{
"Key": "WaferSupply",
"DisplayName": "供片准备",
"ActivityKeywords": [],
"WorkflowKeywords": [
"WaferAngleAdjustmentFlow",
"DiePositionFlow",
"DieTransferFlow",
"DieRecheckFlow"
],
"ParentKeywords": [
"DieAlign",
"DieBond",
"Inspect"
]
},
{
"Key": "WaferUnload",
"DisplayName": "晶圆下料",
"ActivityKeywords": [
"ChipUnload",
"ChipUnloadExecute"
],
"WorkflowKeywords": [],
"ParentKeywords": []
}
]
}